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2 edition of Design and modeling of devices for measuring adhesion in micro electro mechanical systems (MEMS). found in the catalog.

Design and modeling of devices for measuring adhesion in micro electro mechanical systems (MEMS).

Liangqi Yu

Design and modeling of devices for measuring adhesion in micro electro mechanical systems (MEMS).

by Liangqi Yu

  • 127 Want to read
  • 24 Currently reading

Published .
Written in English


About the Edition

The thesis first presents a theoretical framework to analyze various surface forces that cause adhesion between microstructures. Next, a chip consisting of devices for measuring adhesion forces between micro objects on the chip is designed. Sizes of thermal actuators, sensors, springs and objects are calculated and determined. Finally, actuators were simulated by ANSYS to verify the functionality and reliability of the devices. The simulations show that thermal actuators can generate large deflection and force. The array is shown to be able to couple the forces of the individual actuators.The designed chip will be used for gathering adhesion data which are extremely useful for the study and research of adhesion in MEMS technology.Adhesion between micro structures is one of the major causes for device failures in Micro Electro Mechanical Systems (MEMS). In this thesis, MEMS devices are designed to measure adhesion between micro objects. Micro actuators, sensors, springs and objects are designed in a functional MEMS chip for measuring adhesion forces.

The Physical Object
Pagination84 leaves.
Number of Pages84
ID Numbers
Open LibraryOL19551777M
ISBN 109780494212967

Searching for Micro Electro Mechanical Systems information? Find it FREE at Best of the Web. Research the Sciences, find astronomical facts, discover the wonders of biological processes, the beauty of mathematical expressions, and the latest from a wide range of scientific studies.   The intermolecular adhesive forces in microelectromechanical systems (MEMS) applications are very significant and can hinder normal operation of sensors and actuators as well as micro-engines where catastrophic adhesion and high friction could be promoted. It has been experimentally shown that surface texturing (roughening) decreases the effect of these forces. Cited by:

This chapter discusses silicon based bioMEMS-micromachining technologies. BioMEMS, or Bio-Micro-Electro-Mechanical Systems, integrates microsystems technology with applications in biology and the life sciences. Disposable and miniature clinical diagnostic systems are mechanisms to increase patient throughput in point-of-care clinical settings. In recent decades micro-electro-mechanical systems (MEMS) have been used in novel devices of various defense, medical, and commercial applications because of their low cost, miniature size, low-energy consumption, and life-time [1]. Another fast moving and value pursuing area is micro energy generating devices which.

The Waterloo Institute for Nanotechnology (WIN) is located at the University of Waterloo and is co-located with the Institute for Quantum Computing in the Mike and Ophelia Lazaridis Quantum-Nano Centre (QNC).WIN is currently headed by Dr. Sushanta Mitra.. The Waterloo Institute for Nanotechnology comprises 96 faculty from nine different departments in the faculties of Affiliation: University of Waterloo. the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through micro fabrication technology. To develop a MEMS Micro gripper that is cheap and easy to fab Design, Coupled Field Simulation and Implementation of Micro- Electro Mechanical Gripper by Finite Element Method Approach.


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Design and modeling of devices for measuring adhesion in micro electro mechanical systems (MEMS) by Liangqi Yu Download PDF EPUB FB2

Micro Electro Mechanical System Design is that resource. It is a comprehensive, single-source guide that explains the design process by illustrating the full range of issues involved, how they are interrelated, and how they can be quickly and accurately by: This book builds on the extensive body of literature that already exists on analytical and numerical multi-Physics "modeling" and provides a structured approach to microsystem design.

"Micro Electro Mechanical Systems (MEMs): A Design Approach" focuses on the development of a standard methodology for MEMs using Six Sigma : Kanakasabapathi Subramanian.

MEMS (micro-electro-mechanical systems) or simply micro-systems are miniaturized structures that perform one or more optical, mechanical, electronic, thermal or magnetic functions on a single chip. These systems sense, control and actuate on a micro scale and can function individually or can be arrayed to generate effects on a macro scale.

Micro Electro Mechanical System Design is that resource. It is a comprehensive, single-source guide that explains the design process by illustrating the full range of issues involved, how they are interrelated, and how they can be quickly and accurately addressed.

Modelling of spontaneous adhesion phenomena in micro-electro-mechanical systems Article in European Journal of Mechanics - A/Solids – May. Water Bug The weight of the water bug scales as the volume, or S3, while the force used to support the bug scales as the surface tension (S1) times the distance around the bug’s foot (S1), and the force on the bug’s foot scales as S1×S1=S2 When the scale size, S, decreases, the weight decreases more rapidly than the surface tension forces.

MEMS devices can be fabricated by two generic routes: bulk machining, and surface micromachining. Bulk micromachining was the first of the fabrication methods to be investigated, material is removed from a substrate in order to create micro-features. Perhaps the most common method of removing this material is chemical etching.

Abstract. We introduce a new conceptual-design methodology for the qualitative-motion synthesis of micro-electro-mechanical systems (MEMS). The approach abstracts the functionality of MEMS building blocks as matrices and allows for the symbolic synthesis of systems via Cited by: 1.

Computer Aided Design of Micro-Electro-Mechanical Systems From Eigenvalues to Devices David Bindel Department of Computer Science () – high-Q mechanical resonator device modeling AxFEM () – solid-wave gyro device modeling Goal today: two illustrative snapshots.

Radio devices: cell phones, inventory tags, pico radio. Use. MICRO-ELECTRO-MECHANICAL SYSTEMS. PART 1: FULL 3D-MODELS ALEXANDRE A. SEROV ABSTRACT. The paper is dedicated to a state-of-the-art review of the numerical methods used in the simulation of Micro-Electro-Mechanical Systems (MEMS).

We treat all the basic approaches that are used for the realization of modern methods of MEMS simulation.

Introduction to Micro-Electro-Mechanical Systems (MEMS) design. The course will begin with an overview of MEMS devices and the processes that are used to fabricate them. The basic governing equations for MEMS devices in different energy domains (mechanical, electrical, optical, thermal and fluidic) will be reviewed.

8 Simulation of Micro Electro-Mechanical Systems (MEMS) on Grid computational nodes, and a performance analysis will be carr ied out to show the benefit of using such an infrastructure. Micro-Electro-Mechanical Systems Chemical, fluid, thermal, optical (MECFTOMS?) Applications: Sensors (inertial, chemical, pressure) Ink jet printers, biolab chips Radio devices: cell phones, inventory tags, pico radio Use integrated circuit (IC) fabrication technology Tiny.

Finite Element Analysis of Micro – Electro – Mechanical Systems: Towards the integration of MEMS in design and robust optimal control schemes of smart microstructures. JOHN K. SAKELLARIS. Faculty of Applied Mathematics and Physics.

National Technical University of Athens. 9, Heroon Poytechniou, Zografou. GREECE. [email protected] Cited by: 3. M icro-E lectro-M echanical-S ystems (MEMS) Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through the use of micro fabrication technology.

Microelectronic integrated circuits (ICs) can be thought of as the "brains" of systems and MEMS augments (its decision-making. An innovative approach for the numerical study of spontaneous adhesion (or stiction) phenomena in Micro-Electro-Mechanical Systems (MEMS) is proposed, based on the use of 3D Finite Element (FE) on is a major reliability problem in MEMS which can completely destroy the normal mobility of parts which have the task e.g.

to sense the external acceleration in micro Cited by:   An interferometric microscope is used to align the array and the substrate and to record deflection profiles and adhesion lengths during peel-off. This geometry is accurately modeled using linear elastic fracture mechanics, creating a robust, reliable, standard method for measuring adhesion energies in stiction-failed by: 3.

falls into the Micro-electro-mechanical Systems (MEMS) arena, because they have both electrical and mechanical parts in the device. Development of MEMS devices needs special processes and machines when compared to pure micro-electrical devices, which does not have any mechanical parts.

The modeling, design, manufacturing, and testing of. experimentally obtained and used to improve modeling accuracy. Keywords Micro-electro-mechanical systems (MEMS), Microelectronics packaging, Advanced packaging, Chip on board (COB) Paper type Research paper 1.

Introduction The problem of moisture absorption and subsequent package failure at elevated temperature is an issue to the reliability ofCited by: The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications.

Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of.

@article{osti_, title = {Design of Surface micromachined Compliant MEMS}, author = {Bradley, Joe Anthony}, abstractNote = {The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor.

MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing .Modeling Pressure and Fluid Systems Design and Installation: Transmission Effects Fluid Velocity Measuring Systems Summary References Nomenclature Problems Contents vii.Micro Electro Mechanical System is a system of miniaturized devices and structures that can be manufactured using micro fabrication techniques.

It is a system of micro sensors, micro actuators and other micro structures fabricated together on a common silicon substrate. A typical MEMs system consists of a micro sensor which senses the.